Bluetooth low energy portfolio expanded

Delivering more available memory, Bluetooth 5-ready hardware, automotive qualification and an ultra-small wafer-chip-scale package option, the CC2640R2F and CC2640R2F-Q1 have been added to Texas Instruments’ scalable SimpleLink Bluetooth low energy CC264x wireless MCU family.

The devices are said to feature advanced integration, including a complete single-chip hardware and unified software solution with an ARM Cortex-M3 based MCU, automatic power management, flexible full-featured Bluetooth-compliant radio and a low power sensor controller.

The CC2640R2F MCU offers more available memory and comes in a 2.7 x 2.7mm chip-scale package option. The CC2640R2F is ready for the Bluetooth 5 core specification which offers longer range, higher speed and more data for enhanced connection-less applications in building automation, medical, commercial and industrial automation.

The CC2640R2F-Q1 MCU enables smartphone connectivity for car access including passive entry passive start and remote keyless entry, as well as emerging automotive use cases with AEC-Q100 qualification and Grade 2 temperature rating.

Additionally, the device is offered in a wettable flank QFN package which is said to help reduce production line cost and increases reliability enabled by optical inspection of solder points.

These additions allow developers to reuse their project across pin- and code-compatible low power CC264x wireless MCUs. The scalable SimpleLink family will enable product optimisations based on size, system cost and application requirements rather than using a one-size fits all solution.

Additionally, the CC264x family is supported by a unified software and application development environment, royalty-free BLE-Stack software, Code Composer Studio integrated development environment, system software and interactive training materials.

Author
Peggy Lee