Feature a dual-layer contact design for very low contact resistance

Heather Hamilton, contributing writer

TE Connectivity recently
released its high-density
plus (HD+) card-edge power
for data centers. The card-edge power connectors offer the highest
current density for these types of interconnects, according to the company, and
support power supplies up to 3 kW. These new interconnects enable systems with increasing
power requirements in next-generation data centers.

new HD+ card edge power connectors not only support the highest current density
among all card edge connectors in the market, but they can offer strong
dependability through our dual-layer contact design,” said Bandy Yuan,
product manager, TE Connectivity.

a current density of 15 A/2.54 mm, the HD+ card-edge connectors support
2000-3000-W power supplies for data center equipment. They feature a 1.27-mm
signal contact pitch and a 5.08 power contact pitch with a working voltage of
60 VDC. 

connectors also boast low contact resistance thanks to the dual-layer design of
the DC power contacts and pass-through pins, which facilitate multiple
mating/contact points to the PCB. They’re designed in the common industry PCB
footprint, leveraging a compact and cost-effective design, with a common power
and signal contact module, said TE.

addition, the connectors deliver a flexible configuration with different
contact quantities and positions, and support both AC and DC in low-power and
high-power applications, helping designers attain better scalability. The
connectors target server, switch and mass storage system applications.