PCB Design & Assembly


Tin Whiskers Failures and Reliability Issues – RoHS Lead-Free Design Guide

Tin Whiskers pose a serious reliability risk to electronic assemblies in RoHS Lead-free design, whose components are having pure Tin or Matte Tin. Tin Whiskers Metal Vapor Arc, Tin Whiskers Debris Contamination, Tin Whiskers Transient Short Circuit Failures are the ROHS Reliability issues associated with Tin Whiskers.

Read more >>> Tin Whiskers Failures and Reliability Issues – RoHS Lead-Free Design Guide

Tin whiskers is a major problem of RoHS Lead-free design, whose components are having pure Tin or Matte Tin. While the precise mechanism for whisker formation remains unknown, it is known that whisker formation does NOT require either dissolution of the metal NOR the presence of electromagnetic field. The mechanisms by which tin whiskers grow […]

Read more >>> Tin Whiskers Formation – RoHS Lead-Free Design Guide

Tin Whiskers is a major problem of RoHS Lead-free design, whose components are having pure Tin or Matte Tin. Tin Whiskers Shapes and Length, Tin Whiskers Growth Rate observations reported by different experimenters is evidence of the complications associated with understanding and controlling tin whiskers.

Read more >>> Tin Whiskers Growth Characteristics – RoHS Lead-Free Design Guide

Two common noise-related analog phenomena encountered by FPGA digital designs are ground bounce and VCC sag. Ground bounce and VCC sag exist to some degree in almost every board. Normally, if ground bounce occurs on a board, VCC sag occurs as well. Ground bounce occurs when most, if not all, of the bits of the […]

Read more >>> PCB Layout Design Guidelines for FPGA Ground Bounce & Vcc Sag Reduction

Printed circuit board (PCB) layout design becomes more complex for high-speed system design with high frequency and higher device pin density. A successful high-speed board must effectively integrate the devices and other elements while avoiding signal transmission problems associated with high-speed I/O standards. Because today’s high density CMOS devices feature fast I/O pins, a wide […]

Read more >>> High-Speed PCB Layout Design Guidelines for Signal Integrity & EMI Inrference Noise Reduction

Low-Voltage Differential Signaling (LVDS) is a high-speed, low-voltage, low-power, and low-noise general-purpose I/O interface standard. The low-voltage swing and differential current mode outputs significantly reduce electromagnetic interference (EMI). These outputs have fast edge rates that cause signal paths to act as transmission lines. Therefore, ultra-high-speed board design and differential signal theory knowledge is especially useful […]

Read more >>> PCB Design & Layout Guidelines for LVDS Boards

Molex recently released the ClipLok™ interconnect clip, an electomechanical connection that easily attaches to secure a membrane switch or FPC tail firmly to a printed circuit board, eliminating the need for mating connectors at each point. A first-to-market product, the low-profile ClipLok interconnect clip provides immediate and reliable circuit-to-board connectivity in a range of consumer, […]

Read more >>> PCB Secure Circuit-to-Board Connections with ClipLok Interconnect Spring Clip

Heat generation from silicon microprocessors is highly non-uniform both spatially and temporally, with localized high heat fluxes that vary with the workload. Current electronics cooling technologies based on conduction and convection can potentially cool moderately high heat fluxes by utilizing either novel passive heat transport materials (such as carbon nanotubes) or advanced heat exchangers (such […]

Read more >>> Cooling Hot Spot PCB Components – Cooling Microprocessor & Power ICs using Thermoelectric Cooler

Laptops, Computers and Cellular Phones are the highest produced electronic products in recent days. And the lifetime of these products are very less. Recycling of electronic products is critical for preserving landfill space and for ensuring that hazardous materials used to make electronics are properly disposed or recycled. Disposal and recycling of waste electronics products […]

Read more >>> Recycling Laptop Computers & Mobile Phones

Electronics Product Manufacturing Issues of RoHS Implementation are the unavailability of RoHS materials, components, and manufacturing processes. Reliability Issues of RoHS soldering Materials & RoHS Manufacturing are Unproven RoHS Alternates, Effects of Higher Temperature Soldering, Solder Joint Reliability, Tin Whiskers, etc. Cost Issues of RoHS Implementation are Costly Redesigns due to Component Obsolescence, RoHS Analysis, and RoHS Components costs & RoHS Manufacturing costs.

Read more >>> RoHS Lead-Free Soldering Materials & RoHS Reliability Issues

As RoHS banned the usage of Lead (Pb), now the semiconductor industry is searching and researching for various alternatives to Tin/Lead (SnPb). They could find a lot of alternatives such as Matte Tin, Tin-Bismuth (SnBi), Tin-Copper (SnCu), Tin-Zinc (SnZn), Nickel-Palladium (NiPd), Nickel-Palladium-Gold (NiPdAu), Nickel-Palladium-silver (NiPdAg), Tin-Silver (SnAg), Tin-Indium (SnIn), Tin-Silver-Copper (SnAgCu), etc. But until now, […]

Read more >>> Matte Tin is the Top RoHS Lead-Free Alternative to Tin-Lead (SnPb)

RoHS Directive RoHS stands for ‘Restriction of Hazardous Substances’. RoHS banned the usage of 6 hazardous materials namely Lead (Pb), Mercury (Hg), Cadmium (Cd), Hexavalent Chromium, PBB, PBD. RoHS banned these 6 materials for new electronics designs. So RoHS is considerable during the design & manufacturing stages of all electronic equipment. WEEE Directive WEEE stands […]

Read more >>> RoHS Vs WEEE Vs ELV Comparison for Electronics Design

Halogen-Free has recently been hot topic in the electronics industry due to increasing concern over environmental issues. A voluntary initiative has been undertaken by the electronics industry, known as the “Halogen-free Initiative.” This self imposed initiative bans the use of halogenated materials in the manufacture of electronic equipment. Certain types of halogenated materials have a […]

Read more >>> Halogen-Free & Halide-Free PCB & Soldering Materials in Electronics Manufacturing

RoHS Issues and High Temperature Effects of Lead-Free Solders are discussed for electronics manufacturing, discusses Thermal fatigue of solder joints, Delamination of multi-layer PCB, Popcorn failures of IC packages, Degradation or Damage to heat sensitive components, Component failures, PCB failures, Variance in component parameter values, component life wear out or ageing issues

Read more >>> RoHS Issues – High Temperature Effects of Lead-Free Solders

RoHS Implementation Cost Issues, Manufacturing Issues, Reliability Issues (solder joint reliability, tin whiskers). RoHS Compliance Lead-free design for Telecom, Automotive, consumer electronics, Aerospace, etc.

Read more >>> RoHS Lead-Free Design & PCB Manufacturing

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