TE Connectivity’s OSFP family consists of connectors, cages, and passive copper cable assemblies in multiple configurations, gauges, and lengths

By Gina Roos,
editor-in-chief

TE Connectivity (TE)
recently unveiled its Octal Small Form Factor Pluggable (OSFP) connector and
cable assembly portfolio, targeting next-generation data center requirements
for data rates of 200 Gbits/s and 400 Gbits/s. They support the latest 8×28G
NRZ and 8×56G
PAM-4 protocols, with a roadmap to support 8×112G PAM-4 for future system
upgrades. Applications include servers, routers, switches, and storage
equipment.

TE said that by leveraging integrated thermal heat sink
technology, the OSFP family
provides superior thermal performance and signal integrity required for 400-Gbits/s
data rates. The OSFP products can fit up to 36 400G ports into a 1RU switch
form factor to meet next-generation switch silicon roadmaps.

The OSFP portfolio includes surface-mount
connectors, 1 × 1
and 1 × 4 cages, and straight and breakout passive
copper cable assemblies in multiple configurations as well as various lengths
and gauges. The OSFP products are optimized for front-to-back and back-to-front
airflow and are designed for up to 15-W thermal loads with low airflow.