TE Connectivity’s XLA socket technology for next-gen data centers offers superior warpage control

By Nicole DiGiose, technical content editor

TE Connectivity recently unveiled
its extra-large array (XLA) socket technology, which provides more reliable
performance with 78 percent better warpage control than traditional molded
socket technologies. The XLA socket technology allows enhanced sockets to
support high-data speeds in next-generation data centers. 

Image source: TE Connectivity.


The utilization of printed circuit board (PCB) substrates versus other
plastic materials results in minimal warpage, enabling TE to design the
industry’s largest one-piece socket with sizes up to 110 mm x 110 mm and a
10,000+ position count capability. Due to such a large capacity, these sockets
are capable of extremely fast data rates up to 56 Gbits/s.

Product features include:

  • Socket housing facilitates efficient soldering to
    the PCB.
  • Socket is supplied with a cap to facilitate vacuum
    pick and place.
  • Backplates are available in zinc or nickel plating.

“TE’s XLA socket
technology provides the ability to scale to extremely high pin counts, staying
ahead of market demand for next-generation switches and servers,” said Erin Byrne, vice president, engineering and chief technical officer for Data &
Devices at TE Connectivity, in a statement. “The XLA socket will enable the
expansion in scale and performance needed for future high-performance computing
and processing.”


Other benefits cited include 33 percent improved true position on the
solder ball and contact, low coefficient of thermal expansion (CTE) mismatch to
motherboard, and mitigation of SMT risks during customer application. Two
versions are available: the hybrid land grid array/ball grid array (LGA/BGA)
and the dual compression LGA/BGA.