Heterogeneous integration encompasses rapidly evolving design concepts, packaging architectures, device types, materials, manufacturing processes and systems integration technologies.


Editor’s
Note:
 AspenCore Media’s editors have been closely following
the development of the Heterogeneous Integration Roadmap (HIR). As part of
this Special Project on the topic, we solicited perspectives from
celebrated heterogeneous integration proponent
Nicky Lu
, Intel Fellow Ravi Mahajan  and veteran packaging analyst E. Jan
Vardaman.
 

Dylan McGrath, EE Times’
editor-in-chief, begins the special report by discussing the HIR efforts by
various players in the industry that are mapping out the future of the semiconductor
industry beyond Moore’s Law.

Because the
concept of heterogeneous encompasses rapidly evolving design concepts,
packaging architectures, device types, materials, manufacturing processes and
systems integration technologies, the HIR effort involves participation from
throughout the supply chain — chipmakers, materials suppliers, equipment
companies, test/assembly providers, EDA firms and others, said McGrath.

The HIR
effort aims to identify the requirements for heterogeneous integration (HI) in
the electronics industry through 2031, identifying challenges and potential
solutions. A draft of the roadmap is now expected to be released in
mid-October, followed by annual updates.

The report
also includes several contributed pieces from luminaries of the industry on the
topic of HI. Ravi Mahajan, an Intel Fellow, makes the case for heterogeneous
integration. Nicky Lu, chairman, CEO and founder of Etron Technology discusses
the benefits of HI and why the roadmap needs much broader and deeper
participation from a more diversified group of technical, business and
application stakeholders. E. Jan Vardaman, founder and president of
consulting company TechSearch International Inc., addresses the importance of the roadmap as a guide
to determine the most appropriate package for a specific application.

 Below is a listing of all stories in this
Special Package:

Mapping the Future of Electronics
Dylan McGrath, editor-in-chief, EE Times
Increasingly, engineers and chip firms are eyeing the concept of heterogeneous integration — separately manufactured silicon and non-silicon components integrated into a higher-level system in the same three-dimensional system-in-package — as the electronics productivity driver of the future.

The Case For Heterogenuous Integration
Ravi Mahajan, Intel
Heterogeneous integration offers computing and communications devices enhanced
functionality, faster time to market and silicon yield resiliency.

Why I’m Involved With the HI Roadmap
Nicky Lu, Etron Technology 
As Moore’s Law — which has driven exponential economic and industry
growth — reaches its limits, the semiconductor, IC and microelectronics
industries need another exponential growth driver

A Big Journey Calls for a Map
E. Jan Vardaman, TechSearch International
Heterogeneous integration is an economic solution that addresses the end of
silicon scaling as historically documented by Gordon Moore.