In today’s world, the demand for ultra-high-speed PCB design is on the rise. High-Speed PCBs and High Frequency PCB circuit boards are widely used in wireless networks, wireless communications and satellite communications, in particular the popularity of 3G networks exacerbate the market demand for the product on the HF PCB. With the advance of highly specialized design and layout software, the design of these boards has become increasingly ‘easy’ (automated).

Access to wireless high speed data is quickly becoming a necessity in multiple markets like Defense/Aerospace and Mobile Networks. Engineers are assigned the task of design mixed analog and fast rise-time digital boards, and have all signals arrive at their destination cleanly.

Evolving market needs continue to drive forward development of high frequency circuit board materials. Whether it be low frequency wireless infrastructure or more demanding, like +60 GHz microwave radios or defense airborne systems, new materials are being introduced to enable the next generation designs.

The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component. For many applications, it is sufficient to use FR4 material with an appropriate layer buildup.

What is High-Frequency PCB?

High-Frequency PCB Circuit Boards have high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent. Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate.

High-Frequency PCB Selection

In High-frequency and High-speed applications the rise time and fall time depends on the PCB trace impedance. Depending on various parameters, HF signals are reflected on circuit board, meaning that the impedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.

PCB trace impedances in high frequency circuit boards are principally depend on the conductor trace geometry, the layer buildup, and the dielectric constant (er) of the materials used. For some special high-frequency application, Teflon PCB material and Rogers PCB materials are used.