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(Image courtesy of Hirose).

Hirose has developed a hybrid power and signal board-to-board connector that features high-speed transmission capability up to 8 Gbps and a highly reliable floating contact mechanism that simplifies assembly. The FX23 Series is designed for a wide range of high-speed applications including medical devices, office imaging equipment, measurement equipment, industrial computer systems, automotive navigation and audio systems, broadcast equipment, base station transceivers, industrial machinery and more.

A member of Hirose’s FunctionMAX family of high-speed board-to-board connectors, the 0.5mm pitch FX23 Series connector supports high-speed applications with a specialized contact structure that utilizes a ground contact between adjacent differential pairs to reduce crosstalk. In addition, this contact structure provides superior impedance matching, even with short rise times.

The connector’s floating design offers a degree of play between the contacts during mating, allowing the board-to-board connector to absorb alignment errors up to ± 0.6mm in X and Y axis directions. By self-centering in both the X and Y directions, the floating structure eliminates mechanical stress at the SMT leads. This unique floating contact structure is particularly convenient when mating multiple connectors on the same printed circuit board, saving significant assembly time and costs.

The hybrid power and signal connector has two built-in power contacts located on each side of the FX23 Series connector housing that provide a power rating of 3 Amps per pin. The hybrid structure also reduces the number of pins required, saving space. Available in right angle and parallel versions, the FX23 Series is offered in 20, 40, 60, 80, 100 and 120 positions.