200µm thickness guarantees thermal stability up to 400°C with thermal conductivity up to 400W/mK

Munich, December 2016: Panasonic Automotive & Industrial Systems Europe has launched a highly-compressible Thermal Interface Material (TIM) to reduce contact thermal resistance between rough surfaces in extremely thin spaces.
Soft-PGS enhances the thermal coupling between heat producing devices (heat sources) and heat dissipation devices (heat sinks).

Thermal Interface Material (TIM) is a key component in the majority of power electronic systems. Heat generated by semiconductors, has to be transferred to a heat sink and ultimately dissipated. Soft-PGS is a 200µm thick graphite sheet designed for use as a thermal interface material for IGBT modules. As Soft-PGS can be compressed by 40% it is an excellent solution for dramatically reducing thermal resistance between a heat sink and an IGBT module. The 200µm thick Soft-PGS sheet is easy to install, and has far lower labour and installation costs than thermal grease or phase change material. Soft-PGS guarantees thermo stability of up to 400°C and high reliability against intense heat cycles (-55°C to +150°C). Its thermal conductivity is guaranteed at 400W/mK for X-Y direction and at 30W/mK in Z direction. Panasonic offers a wide range of standard sheets for different IGBT modules from various suppliers.

Comments Simone Saile, Product Manager, Thermal Solutions & Ceramic Devices at Panasonic: “Reducing the volume of the heat sink combined with increased local power densities leads to greater demands on the thermal interface connecting power electronic components to the heat sink. A paste-like TIM-layer below a module is never of homogenous thickness and additionally, most paste-like thermal solutions also degrade and age over time. Compared to thermal grease and PCM, Soft-PGS fits uneven surfaces far better as well as offering superior workability, reliability and thermo stability.”