Advancements in the electronics industry have led to a
significant increase in the power densities, which, in turn, have driven the
development of smaller and smarter products. The need for advanced heat
dissipation solutions in these smaller products is critical and is expected to
drive the industry growth in the near future, according to a new report from
Grand View Research. 

Some chip-cooling solutions have evolved over the past
few years to accommodate the increase in heat flux. Manufacturers are working
on the development of advanced cooling solutions based on multi-phase heat
transfer technologies. Technologies such as jet impingement mechanisms, cold
plates, and heat vapor chambers have revolutionized these systems. However,
various component and system level technological issues, such as the heat
effect on transistor operation, spatial and temporal variation in the heat
load, multiple heat transfer interface, and acoustic noise emissions, are
presumed to challenge technological advancements. These challenges are expected
to impact the market growth negatively over the forecast period.

 

wcpo_ThermalMgmtbyApp_26sep2016

 

North America thermal management
technologies market by application, in USD Million (Grand View Research)

 

 

Thermal management hardware is expected to remain the
leading segment over the next eight years, owing to the increase in the
production of miniaturized microprocessors. The hardware product segment has
benefited significantly from the increased implementation of heat removal
solutions in high-volume commodity systems. Thermal management interface
products are estimated to witness a significant growth over the forecast
period. The growth in this segment can be attributed to the increasing implementation
of interfaces in the automated assembly. These interfaces are regarded as the
key heat dissipation solutions for portable and compact electronic devices. The
smartphone and the tablet material market have witnessed a considerable growth
in the past decade. Owing to the sensitivity toward the weight and the costs,
these markets are envisioned to rely largely on advanced materials for cooling
solutions rather than secondary heat sinks.

 

The applications analyzed in the report include
computers, renewable energy, automotive, telecommunication, and consumer
electronics. Computers dominated the overall industry share in 2015 and are
expected to retain their dominance over the next few years. This growth can be
attributed to the increasing demand for these solutions to optimize the
computer-cooling process to control a large amount of heat produced during the
operation. The rise in the operating frequencies for improved performance and
the continued reduction in the size of ICs and other components are anticipated
to drive the growth in the coming years.

 

Automotive electronics is expected to
witness a significant growth over the forecast period, owing to the rising
complexity, value, and quantity of electronics in the passenger, as well as the
commercial heavy-duty vehicles. This rise has led to the development of
advanced products that offer adequate heat dissipation, grounding, and shielding
to the components, as well as the equipment. The development of electric
vehicles has driven the need for heat removal in electric motors. The report
also breaks down thermal management by global area and lists the key players
in the market. For more information: http://tinyurl.com/jbo5pad