Silicone Potting/Encapsulating Compound Adds Little Weight To End Product

Epoxies Etc.
October 25, 2016

When adding less weight to electronic assemblies is an important consideration, the 20-1634 silicone-potting compound is reportedly less than half the weight of most commercially available potting and encapsulating compounds. It relies on advanced micro balloon technology fillers to achieve a specific gravity of 0.82. Many filled potting compounds can have specific gravities of 2.0 or higher. The 20-1634 is also formulated without solvents or other toxic materials. More details are available at

Epoxies Etc.
Cranston, RI


Company Epoxies Etc.
City Cranston
Country United States (USA)
Phone 401-946-5564