The flexible
printed circuit (FPC) connectors from Hirose offer ultra-low profile and space-saving
that smartphone designs demand due to limited internal space on the main board.
The FH64MA Series
connector features 0.5-mm height, 0.25-mm contact pitch, and 3.15-mm depth.

Modern
smartphones are increasingly using organic electroluminescent (EL) display, and
that inevitably requires smaller chips like driver ICs and other components
such as connectors. Furthermore, smartphone designers are moving away from
connecting the display and touchscreen to the main board toward employing
relays for connecting the touchscreen to the display.

However, while
using relay connections, driver IC and other chip components fall into the
vicinity of the connector. And it mandates that the FPC connector height is
aligned with chip components.

Hirose claims
that the FH64MA Series connectors perfectly align with the height of driver IC
and other chip components in the connector vicinity. These connectors can also
be mounted in the narrow dead space between FPCs and the main board, further boosting the efficient
utilization of the board space.

The FPC connectors include mating guides and
support offset pitch and slanted insertion of the FPC from the top. Additionally,
they boast superior FPC insertion, which is crucial in automatic robotic
mounting operations.