PCB Design and Assembly

 

PCB Traces Current Carrying Capacity and Temperature Rise

Current Carrying Capacity of PCB Traces The current carrying capacity of PCB traces could be different than the value presented in standards and datasheets or obtained after solving thermal equations. According to IPC standards, the current carrying capacity of PCB traces represents the maximum electrical current that can be carried continuously by a trace without […]

Read more >>> PCB Traces Current Carrying Capacity and Temperature Rise

High Temperature PCB Design is the necessity of High-Temperature Electronics that pose Design and Reliability challenges. High Temperature PCB ( High Tg PCB ) is a good choice for electrical equipment of the high temperature environment. Electrical equipment will be better performance, use High-Temperature PCB in high-temperature state. Many industries are calling for electronics that […]

Read more >>> High Temperature PCB Designer Guide

Popcorn Failures are because of moisture sensitivity of IC Packages, and thermal stress during soldering while PCB assembly. Improper storage, handling, or packaging of plastic encapsulated semiconductor devices can allow the introduction of moisture. Moisture trapped inside plastic encapsulated packages can damage them during soldering, as the moisture vaporizes and tries to expand. The expansion […]

Read more >>> Popcorn Failures of IC Packages – MSL Components Reliability Guide

PCB Delamination is a common problem for high-density multi-layer printed circuit boards (PCB). Boards are probably delaminating because, during processing, they are thermally and/or mechanically stressed beyond their limits of adhesion.

Read more >>> Delamination of Multi-layer PCBs – PCB Reliability Guide

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