ROHS Lead-Free Design Guidelines

 

RoHS XRF X-Ray Fluorescence Analyzer

X-Ray Fluorescence (XRF) RoHS Analyzer is the most common tool used for RoHS compliance testing. XRF RoHS Analyzers come in stand-alone, bench-top and handheld formats. XRF RoHS testing using a portable handheld XRF analyzer is usually performed first and focuses on the parts of a product with the highest risk of containing restricted substances. RoHS […]

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RoHS Restricted Materials The EU RoHS Directive (2011/65/EU) restricts the maximum allowable levels of six hazardous substances: lead (Pb), cadmium (Cd), hexavalent chromium (Cr6+), mercury (Hg), polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) flame retardants to 0.1% or 1000 ppm (except for cadmium, which is limited to 0.01% or 100 ppm) by weight of […]

Read more >>> RoHS Testing – RoHS Screening

Software technology makes the electronics system design easy, and reduce a lot of manual work done by engineers. There are already a plenty of software tools available for most of the electronics design, simulation, testing, design analysis, manufacturing, verification, and validation of prototype hardware. A lot of environmental regulations such as WEEE, RoHS, REACH SVHC, […]

Read more >>> Software Tools for RoHS REACH Compliance

RFID tags (Active RFID tags, and Passive RFID tags) are often used attached to other articles, for example for stock identification or theft control. The RFID tag is in these cases not deemed a part of the article, as it is not intended to function together with the article but rather to be removed prior […]

Read more >>> RoHS Compliance for RFID Tags

Are cables within the scope of RoHS 2? Generally from 3 January 2013 cables are in scope of RoHS2, unless they specifically belong to an EEE or a combination of EEE that is outside the scope of RoHS 2. Cables that are used for the transfer of electrical currents or electromagnetic fields are EEE. Cables […]

Read more >>> RoHS Compliance for Wires and Cables in Electrical and Electronics Equipment

Electrical or Electronic Equipment specifically designed solely for the purpose of research and development, which is made available solely on a business-to-business basis, are excluded from the scope of RoHS 2. This is because if this type of equipment were to fall within scope of RoHS 2, it could place a burden on research, scientific […]

Read more >>> RoHS Exemptions – Is R&D equipment excluded from RoHS ?

Are batteries within the scope of RoHS Directive? No. Recital 14 of RoHS 2 specifically states that RoHS should apply without prejudice to the Batteries Directive. Recital 29 of the batteries and accumulators directive (2006/66/EC) states RoHS does not apply to batteries and accumulators used in electrical and electronic equipment. RoHS Directive (2002/29/EC) restricts the […]

Read more >>> RoHS – Batteries RoHS Compliance

Why RoHS-2 Revision? The RoHS-recast was mainly aimed at: increasing the level of legal clarity and certainty, including the facilitation of its harmonised enforcement; developing better regulatory conditions. That means a simple, effective and enforceable Directive; aligning and harmonising RoHS with other EU legislation, such as the New Legislative Framework – ’Marketing of Products Package‘, […]

Read more >>> RoHS-2 Revision Updates over RoHS-1

Thermal fatigue causes serious reliability issues in case of solder joints of surface mount components. Thermal fatigue is defined as thermal expansion leading to degradation or cracking of materials caused by repeated heating and cooling.

Read more >>> Thermal Fatigue of Solder Joints – Lead-free Reliability Design Guidelines

Tin Whiskers pose a serious reliability issue to electronics assemblies with RoHS Lead-free design, whose components are having pure Tin or Matte Tin. Tin Whiskers Risk Mitigation Plans are the precautions to help avoiding/controlling Tin Whiskers.

Read more >>> Tin Whiskers Risk Mitigation Plans – RoHS Lead-Free Design Guidelines

Tin Whiskers pose a serious reliability risk to electronic assemblies in RoHS Lead-free design, whose components are having pure Tin or Matte Tin. Tin Whiskers Metal Vapor Arc, Tin Whiskers Debris Contamination, Tin Whiskers Transient Short Circuit Failures are the ROHS Reliability issues associated with Tin Whiskers.

Read more >>> Tin Whiskers Failures and Reliability Issues – RoHS Lead-Free Design Guide

Tin whiskers is a major problem of RoHS Lead-free design, whose components are having pure Tin or Matte Tin. While the precise mechanism for whisker formation remains unknown, it is known that whisker formation does NOT require either dissolution of the metal NOR the presence of electromagnetic field. The mechanisms by which tin whiskers grow […]

Read more >>> Tin Whiskers Formation – RoHS Lead-Free Design Guide

Tin Whiskers is a major problem of RoHS Lead-free design, whose components are having pure Tin or Matte Tin. Tin Whiskers Shapes and Length, Tin Whiskers Growth Rate observations reported by different experimenters is evidence of the complications associated with understanding and controlling tin whiskers.

Read more >>> Tin Whiskers Growth Characteristics – RoHS Lead-Free Design Guide

RoHS Issues and High Temperature Effects of Lead-Free Solders are discussed for electronics manufacturing, discusses Thermal fatigue of solder joints, Delamination of multi-layer PCB, Popcorn failures of IC packages, Degradation or Damage to heat sensitive components, Component failures, PCB failures, Variance in component parameter values, component life wear out or ageing issues

Read more >>> RoHS Issues – High Temperature Effects of Lead-Free Solders

RoHS Implementation Cost Issues, Manufacturing Issues, Reliability Issues (solder joint reliability, tin whiskers). RoHS Compliance Lead-free design for Telecom, Automotive, consumer electronics, Aerospace, etc.

Read more >>> RoHS Lead-Free Design & PCB Manufacturing

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