Absorbs Extreme Shock CCGA and BGA Components; Novel Interconnect Innovation

Milledgeville, Georgia, USA – TopLine, a leading designer and  manufacturer of electronic components and packaging solutions for PCB assemblies, will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.

CCGA_Micro-Coil-Spring-RoHSMSC technology and its benefits will be explained and discussed by TopLine’s President, Martin Hart, in the TopLine booth, #923, at the IPC/APEX EXPO 2017 trade show in San Diego, California February 14-16, 2017.

Engineers at NASA’s Marshall Space Flight Center initially developed this novel interconnection structure for integrated circuit packages. This innovation replaces traditional CCGA solder columns with the potential to extend life under harsh environments, extreme thermal stress, vibration and shock. The Micro-coil Spring technology provides flexibility in three dimensions between the ceramic (or plastic) package and the PCB board. This technology offers a distinct improvement over cast Pb90/Sn10 solder columns or copper-ribbon-wrapped Pb80/Sn20 solder columns, which have limited flexibility under shear stress. MSC technology offers a novel alternative, providing better flexibility in high temperature and harsh environments.

Micro-coil springs are fabricated from beryllium copper C17200 (Alloy 25) per ASTM B 197. The coils are post-plated with electro-deposited Sn60/Pb40, 100 micro-inches minimum thickness. Micro-coil springs may also be used in place of solder balls on plastic PBGA packages. After reflow at normal tin-lead temperature profiles, Sn63/Pb37 solder paste forms a fillet around the double coil ends of the spring.

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