Master Bond - Ultra low thermal resistant adhesives

As advances in epoxy and silicone materials
constantly evolve, manufacturers of advanced electronic systems will find that
adhesives offer the ability to meet nearly any combination of requirements for
thermal, environmental, and structural stability. As product manufacturers face
greater challenges in assembling die, package, and other components into
products able to cope with increasing heat loads, adhesives are particularly
versatile for bonding, sealing and coating. Moreover, the use of filler
materials in adhesives can help to fine tune the specific performance demands
required to extend product life cycles and meet manufacturing requirements.
Learn more about why and how ultra low thermally conductive adhesives are the
preferred fastening approach in applications requiring careful thermal
management.